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NXP Semiconductors
LPC1111/12/13/14
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
Single 3.3 V power supply (1.8 V to 3.6 V).
10-bit ADC with input multiplexing among 8 pins.
GPIO pins can be used as edge and level sensitive interrupt sources.
Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
Processor wake-up from Deep-sleep mode via a dedicated start logic using up to 13 of
the functional pins.
Brownout detect with four separate thresholds for interrupt and one threshold for
forced reset.
Power-On Reset (POR).
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
12 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as
a system clock.
PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the watchdog oscillator.
Available as 48-pin LQFP package, 33-pin HVQFN package, and 44-pin PLCC
package.
3. Applications
eMetering
Lighting
Industrial networking
Alarm systems
White goods
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC1111FHN33/101
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1111FHN33/201
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1112FHN33/101
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1112FHN33/201
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1113FHN33/201
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1113FHN33/301
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
n/a
leads; 33 terminals; body 7 x 7 x 0.85 mm
LPC1111_12_13_14_0
? NXP B.V. 2009. All rights reserved.
Objective data sheet
Rev. 00.11 — 13 November 2009
2 of 53
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